Jiexi Additive Targets Semiconductor Components with Lightweight Structures and Integrated Cooling-3DPTimes

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Jiexi Additive Targets Semiconductor Components with Lightweight Structures and Integrated Cooling

November 2, 2026 Applications 3DPTimes | English adaptation of authorized source material, November 2, 2026. Images reproduced with permission confirmed by the commissioning publisher. 3

Reported case studies include an 89% lighter linear-motor mount, optimized fluid channels and silicon-carbide cooling parts, using a workflow that combines design, printing and precision finishing.

Wafer-stage cooling assembly presented in the application report. Image from authorized source material; reproduced with permission.

Shanghai-based Jiexi Additive is applying additive manufacturing to semiconductor equipment components, with reported projects spanning lightweight structures, fluid-distribution parts and cooling assemblies. The examples highlight a design-led approach that combines simulation and topology optimization with printing and precision finishing.

A Chinese-language report published on November 2, 2026 describes work presented by company leader Renjie Zhao during October. The headline example is a linear-motor mounting component with a reported 89% weight reduction. That figure refers to a component case study, not to the weight of an entire lithography machine.

Lightweight Design for Precision Equipment

Other reported examples include a 95% weight reduction for an airflow-guiding component used in laser-annealing equipment and a 42% increase in structural stiffness for a silicon-carbide top plate. The figures describe separate projects and should not be combined into a single performance claim. Detailed baselines, load cases and independent qualification results were not provided in the source material.

The company's described workflow begins with material analysis, structural and fluid simulation, and topology optimization. Manufacturing can then combine additive processes with casting, welding, CNC machining, heat treatment and surface finishing, depending on the application. The objective is to supply an engineered component rather than an unfinished print.

Cooling and Fluid Distribution

The reported application range also includes wafer-stage cooling parts, manifolds, gas-distribution components and motor cooling jackets. Curved internal passages and conformal cooling geometries offer alternatives to conventional drilled channel layouts, while metal and ceramic printing address different material requirements.

The examples include a ceramic-printed silicon-carbide cooling disc as well as metal-printed assemblies. These processes should be distinguished: the ceramic disc is not a metal-printing application. Final surface quality, cleanliness and dimensional control remain part of the manufacturing challenge.

Printing Is One Step in a Longer Process

The report lists indicative turnaround times of less than three days for typical plastic parts, less than 14 days for small and medium metal parts, and less than 30 days for large metal parts. It also describes a wire-arc additive manufacturing example involving an approximately 500 kg metal blank produced within ten days, followed by CNC finishing. The ten-day figure therefore should not be read as delivery of a fully finished, qualified semiconductor component.

A reported cost reduction of up to 75% relates to an individual part quotation. It is not evidence of a uniform saving across all component types. For semiconductor equipment suppliers, the commercial value of additive manufacturing depends on the complete route from design and fabrication to inspection and application qualification.

Image Guide

The images below show, in order: a lightweight mirror design and manufacturing sequence; a wafer-stage cooling assembly; a silicon-carbide cooling disc with an internal-channel illustration; and a selection of fluid-handling components. They illustrate application examples and do not independently validate the performance figures.

Sources and Images

English adaptation prepared November 2, 2026 from source material authorized for republication and adaptation by the commissioning publisher. Application images reproduced under the same confirmed permission.

Related published report: Intelligent Manufacturing Network, November 2, 2026: https://m.gkzhan.com/news/detail/196941.html

Company identification and speaker context: Electronics Engineering Times China, October 27, 2026: https://www.eet-china.com/mp/a533985.html

Lightweight mirror development: reference geometry, optimized designs and a manufactured example. Image from authorized source material; reproduced with permission.

Wafer-stage cooling assembly illustrating integrated fluid connections. Image from authorized source material; reproduced with permission.

Silicon-carbide cooling disc and an illustration of its internal cooling-channel layout. Image from authorized source material; reproduced with permission.

Examples of manifolds and other fluid-handling components for semiconductor equipment. Image from authorized source material; reproduced with permission.