Green Laser 3D Printing Breaks the AI Cooling Bottleneck

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April 24, 2026 News 8999

As AI computing power explodes, chip power consumption is heading toward the kilowatt level, making liquid cooling a necessity rather than an option.

Copper, with its excellent thermal conductivity, has become the core material for liquid cooling. However, traditional processes struggle to create complex flow channels, and conventional infrared laser processing of copper suffers from extremely high reflectivity, low efficiency, and instability.

Baochenxin has launched its self-developed green laser additive manufacturing solution (wavelength 532 nm), which fundamentally solves the processing challenges of highly reflective materials such as copper. Its single‑mode green continuous wave laser source (100G–1000G series) uses fiber frequency‑doubling technology to achieve high beam quality, with typical powers of 500 W and 1000 W, a beam quality M² of <1.2, and power stability of ±1%. This solution has achieved 100% self‑development and self‑production of core optical components, with an annual production capacity of 50,000 units and over 20,000 units delivered to date.

Green laser 3D printing can produce microchannel cold plates (channels ≤100 μm), TPMS‑structured cold plates, integrated custom‑shaped liquid cooling components, and pure copper ultra‑thin fin arrays with wall thicknesses as low as 0.1 mm. Heat dissipation efficiency is improved by more than 40%, thermal resistance can be as low as 0.069°C/W, and the heat transfer coefficient exceeds 710,000 W/m²·K, while eliminating the risk of leakage from welded joints.

Baochenxin’s parent company, Chuangxin Laser, has over 20 years of laser technology accumulation, a CNAS‑accredited testing center, and full‑chain quality control. The company is also developing advanced technologies such as ring‑spot and beam shaping. Green laser additive manufacturing is providing the core optical power for intelligent manufacturing of AI liquid cooling systems.