Home  >  Materials

September 26, 2025      Materials      219

China's eSUN has reinforced its leadership in anti-static 3D printing materials with the release of its latest filament, ABS-ESD.

In industries such as electronics manufacturing, semiconductors, sensors, and precision instruments, static electricity is a significant hazard. In minor cases, it can attract dust and affect precision; in severe cases, it can damage components or even pose safety risks. As 3D printing accelerates its adoption within these sectors, the demand for anti-static materials is becoming increasingly urgent.

eSUN, a well-known Chinese 3D printing material company, has announced the launch of ABS-ESD, its latest anti-static material following PETG-ESD. This release further demonstrates the company's leading position in the research and development of anti-static solutions for the industry.

PETG-ESD Lays the Anti-Static Foundation, But Applications Still Have Limitations
Previously, PETG-ESD gained considerable market praise for its stable surface resistance and good print adaptability. Its filament resistance is as low as 10^7 Ω/m, and the surface resistance of printed models can reach 10^9 Ω/m, effectively preventing static electricity accumulation and reducing the risk of electronic components being damaged by electrostatic discharge.
Although PETG-ESD performs exceptionally well in terms of anti-static properties, its heat deflection temperature is only 68°C, and its impact strength is 4.95 kJ/m², which somewhat limits its application range. Currently, this material is primarily used in scenarios related to electronic components, such as transport cases, chip trays, electronic device brackets, and sensor housings.

ABS-ESD Performance Upgrade Expands into More Demanding Application Environments

The newly released ABS-ESD shows significant improvements in mechanical properties and heat resistance, with a heat deflection temperature under 0.45MPa reaching 96°C and an impact strength as high as 19.3 kJ/m². This material not only effectively protects electronic components but can also meet application requirements in high-temperature environments, providing a reliable material choice for more demanding working conditions.
It is understood that ABS-ESD achieves a surface resistance range of 10⁶–10¹¹ Ω by incorporating conductive components into the ABS base material, effectively suppressing static accumulation and reducing risks associated with dust attraction due to static electricity during equipment operation.

This enables ABS-ESD to be applied not only in scenarios where anti-static properties are essential, such as electronic fixtures and instrument housings, but also to leverage the high strength advantages of ABS, making it suitable for printing structural components and functional parts.

In other words, it possesses both anti-static functionality and retains the mechanical properties of an engineering material.

Enhanced Material Forming Stability Meets Higher Application Demands

Addressing user concerns about printability, ABS-ESD has been optimized in its formulation. Its flowability and interlayer adhesion perform well, effectively reducing common issues like warping and cracking during the FDM printing process, thereby improving forming stability. Furthermore, this material is compatible with mainstream desktop or industrial FDM equipment on the market, requiring no additional hardware modifications, which further lowers the barrier to material adoption.

In industrial application scenarios, stability and consistency are key. eSUN indicates that ABS-ESD is not only suitable for R&D and small-batch verification but also has the potential to enter mass production stages.

We believe the introduction of ABS-ESD will broaden the applications for anti-static materials. For example:

Electronic Fixtures: Reduce static damage to components, ensuring production yield.

Industrial Parts: Anti-static functionality can reduce dust adhesion, extending part lifespan.

Computer Housings: Combine impact resistance and anti-static properties to meet complex operational requirements.

Currently, ABS-ESD is available for offline bulk ordering. Interested users can contact eSUN for further consultation and details.

From PETG-ESD to ABS-ESD, it's evident that eSUN is accelerating its布局 in the functional materials sector. In our view, as 3D printing applications continue to expand, industry demands for materials are constantly upgrading. In the future, more customized functional materials tailored for specific scenarios are bound to emerge.

It is foreseeable that during this process, several listed companies will also emerge from the 3D printing materials field. Those who can continuously maintain innovation capability will hold greater initiative in future competition. From the current perspective, eSUN undoubtedly already stands at the pinnacle of the industry.









©2025 3dptimes.com All Rights Reserved