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To meet the protection requirements of precision electronics and integrated circuits, eSUN has launched an anti-static filament, ABS-ESD.

September 23, 2025 Materials eSUN 132

eSUN's ABS-ESD filament provides dual protection for microelectronics with its tunable anti-static resistance and high heat resistance.

eSUN has launched an anti-static filament—ABS-ESD. The surface resistance of ABS-ESD can be freely adjusted between 10⁶~10¹⁰ Ω by setting the printing temperature, enabling a switch from low to high anti-static modes to accommodate various application scenarios requiring static protection. With a heat deformation temperature exceeding 90°C at 0.45MPa, it provides dual protection for microelectronic components.

Deep Anti-static, Robust and Wear-Resistant

ABS-ESD effectively prevents equipment from attracting dust due to static electricity during operation, thereby reducing static sources. It simultaneously retains the excellent strength and toughness of ABS material. Resistant to wear and fracture even under frequent friction and long-term handling, it ensures safety throughout electronic assembly and transportation.

ABS-ESD enables the printing of high-precision models with low warping, thanks to its stable printing performance, low warpage rate, and excellent surface finish, making it suitable for manufacturing complex-structured ESD-safe fixtures, end-of-arm tooling (EOAT), and transport containers.

Overall, ABS-ESD is a permanently anti-static modified material with a surface resistance as low as 10⁵ Ω. It offers easy printing and a smooth surface, balanced strength, stiffness, and toughness, along with a heat deflection temperature exceeding 90°C at 0.45 MPa. It is suitable for applications requiring electrostatic protection for precision electronic components, integrated circuits, and their packaging.