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November 13, 2025      Software      10135

AON3D has launched a physics-based G-code optimization feature that dynamically adjusts deposition rates using material data, slashing print times by up to 54% while maintaining part quality.

AON3D, headquartered in Montreal, has launched a physics-based G-code post-processing feature. This technology can reduce material extrusion 3D printing time by up to 54% without compromising part quality. The software analyzes the rheological properties and thermal behavior of each polymer, predicts how heat accumulates and dissipates during the printing process, and dynamically adjusts the deposition rate. It accelerates in safe zones and decelerates before the risk of melt fracture or thermal deformation occurs.
Precise Control Replaces Trial-and-Error
Adrian Muresan, Vice President of Software Research at AON3D, stated, "Traditional slicing processes rarely consider the physical properties of polymers. Multiphysics Process Optimization incorporates these factors for the first time, making printing outcomes predictable and repeatable."

In internal testing, a 24-hour print job was completed in just 11 hours using the new module. The key to speed enhancement lies in simultaneously considering the material's rheological behavior and thermal conductivity. The system calculates the safest maximum speed for each segment of the print path while ensuring smooth surfaces and strong interlayer adhesion. In contrast, conventional methods either rely on manual parameter tuning or simply switch to a larger nozzle with a fixed set of parameters. These approaches do not account for variations in part geometry or localized cooling, often leading to rough surfaces and unstable interlayer bonding.

Hylo + Basis: Designed for High-Throughput, High-Temperature Manufacturing
AON3D's Hylo printer is built for high-temperature, high-throughput production using engineering polymers. Paired with the Basis software, the system can automatically optimize print parameters and enable real-time quality assessment during printing through in-situ defect detection. The entire platform is designed to reduce reliance on highly skilled operators, lower operational costs, and support the scaling of high-quality additive manufacturing.

AON3D plans to showcase Hylo and Basis at Formnext 2025 (Hall 11.1, Stand E68) and will exhibit jointly with California-based Aether Biomachines. Aether Biomachines develops enzymatic engineering filaments, including a polyamide material that can be printed at speeds more than twice that of conventional materials.

Industry-wide Push for Physics-Based Simulation Implementation

AON3D is not the only company integrating physical models into additive manufacturing. Helio Additive has integrated its thermal simulation software into the Bambu Lab slicer. By simulating temperature gradients and material response, it predicts warping and automatically adjusts parameters to improve print consistency across different geometries and materials.
Synera has also introduced the PanX solver from PanOptimization into its design automation platform, providing thermo-structural coupling analysis capabilities for metal additive manufacturing. Users can run finite element simulations before production to verify design and process feasibility. Unlike these solutions focused on upfront simulation, AON3D's new module acts directly at the G-code generation stage, utilizing real material data to achieve a fine balance between efficiency and safety at the toolpath level.

AON3D's launch of its physics-driven G-code optimization technology marks the first time polymer rheology and heat transfer models have been embedded into the execution layer of extrusion printing. By dynamically adjusting the deposition rate, the system significantly reduces print time while avoiding melt fracture and thermal deformation. This method moves beyond traditional trial-and-error approaches, advancing additive manufacturing towards a more scientific and deterministic future. Combined with Hylo hardware and Basis software, AON3D is building an efficient, reliable, and low-barrier engineering-grade printing solution.







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