eSUN to Showcase Diverse 3D Printing Materials at 2025 Hong Kong Electronics Fair

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October 11, 2025 Materials 223

The Hong Kong Electronics Fair in spring and autumn is recognized as one of the largest and most influential global electronics exhibitions. The 2025 Hong Kong Autumn Electronics Fair will continue to focus on showcasing cutting-edge electronic products and modern lifestyles. Polar Bear has learned that eSUN will bring a variety of 3D printing materials to booth 5E-C02 to jointly explore innovative application demonstrations of 3D printing technology in the electronics industry.

Development and Application of 3D Printing Technology in the Electronics Industry

Housings and Structural Components
Such as electronic device housings, brackets, fixing slots, and heat dissipation guides. With the maturation of modified materials such as flame-retardant and UV-resistant ones, FDM can replace some injection-molded parts for small-batch electronic product housings and industrial tooling.

Embedded Electronics and Functional Integration
Directly embedding sensors, chips, and cables into printed parts to achieve "integrated electronic modules."

Flexible and Wearable Electronics
Such as wristbands, protective cases, shock-absorbing gaskets, and flexible sensor carriers for wearable devices.

Electronic Tooling and Fixtures
Such as positioning fixtures, functional testing tools, and anti-static brackets in electronics production.

Currently, FDM 3D printing technology is widely used for prototyping electronic housings and manufacturing electronic tooling. With the development of multifunctional materials, such as flame-retardant, anti-static, high-temperature, and specialty materials, 3D printing technology will further advance into high-demand scenarios like industrial electronics, automotive electronics, and aerospace electronics.

Introduction to eSUN's Key 3D Printing Materials on Display

As a globally leading 3D printing materials brand, we will showcase a range of innovative materials tailored for the electronics industry at the exhibition:

Anti-Static Materials – Meeting the protection needs of sensitive components in electronic device manufacturing
Currently, eSUN has developed multiple anti-static materials, such as PETG-ESD, ABS-ESD, and PC-ESD, to meet users' diverse needs.

Flame-Retardant Materials – Providing higher levels of safety protection for electronic components
Materials such as ABS-FR and PET-FR meet the UL94 V-0 standard and can match flame-retardant requirements in different temperature environments.

Flexible Elastic Materials – Balancing toughness and adaptability, opening up more possibilities for electronic wearables and creative applications
The demand for flexible 3D printing materials is growing rapidly. eSUN's layout in the flexible materials field is increasingly comprehensive, with not only the new PEBA series but also TPU materials of various hardness levels and functions, which can be widely used in wearable electronics and various innovative application scenarios.

Universal and Aesthetic Materials – Offering more creative expression for the appearance of electronic products
eSUN's PLA series materials come in a wide range of colors and textures, meeting users' personalized customization needs. Additionally, transparent aesthetic materials like PETG and PLA-Clear can be used for sensor visibility windows or customized indicator light-transmitting housings.

At this exhibition, eSUN will focus on demonstrating how 3D printing can drive innovation and upgrading in the electronics industry—from functionality to aesthetics, and from experimental validation to mass production. eSUN remains committed to advancing the industry with innovative materials.

Exhibition Information
Exhibition Name: 2025 Hong Kong Autumn Electronics Fair
Exhibition Dates: October 13–16 (four days)
Venue: Hong Kong Convention and Exhibition Centre (1 Expo Drive, Wan Chai, Hong Kong)
eSUN Booth Number: 5E-C02